SPIRIT: Secured Platform for Intelligent and Reconfigurable voice and data Terminals.
SPIRIT aims to develop a secure reconfigurable platform targeted at high data rate terminals for wireless and professional radio communication networks. The main challenges are pushing the full CMOS integration from digital to RF front end, the multi mode reconfigurability, scalability and security on the platform.
The project aims to achieve global leadership in Europe for secured wireless terminals for Private Mobile Radio (PMR) communication and for broadband consumers markets. Whereever people are in the world, they want to access information and communicate using a variety of wireless networks. This platform will then address different wireless access technologies:
- Narrowband PMR and wideband data IOTA-PMR
- Broadband area communication using advanced OFDM techniques e.g. WLAN, WWAN, IOTA-UMTS (as a candidate for a long term evolution for UMTS)
- Personal area communication using e.g. Bluetooth standards
This platform will also be designed to provide security and flexibility to the user (and to the system), by using a dedicated personal smart card. The interface with the localisation based services (LBS) as a driving force for the user will also be considered. The Spanish consortium participating in this project are Teledyne AnaFocus, Telefonica and IMSE-CNM.
Micro-electronic design of smart sensors for industrial applications.
Project co-funded by the Ministry of Industry, Tourism and Commerce (National Plan for Scientific Research, Development and Technological Innovation 2008-2011) and by the European Regional Development Fund (ERDF). Project Number TSI-020100-2009-39.
This project aims to design two image sensor prototypes: one smart image sensor and one smart vision sensor. These prototypes will be integrated into current smart cameras and vision systems, respectively, enabling them to reduce its size, lower manufacturing and maintenance costs and improve their performance by collecting higher quality images at higher speeds. The project has two main objectives:
- The design of a smart image sensor capable of acquiring, digitizing and conditioning high quality images at frame rates up to 4.000 frames per second (fps).
- The design of a vision sensor integrated on a single chip. This vision sensor will combine the benefits of a high-speed image sensor (1000fps at VGA full resolution VGA) with sophisticated processing structures that will enable on chip implementation of standard image processing algorithms required for machine vision applications.
Installation of electro-optical characterization and wafer test laboratories (clean rooms class 10.000 and 100).
Project co-funded by Ministry of Science and Innovation (National Plan for Scientific Research, Development and Technological Innovation 2008-2011, INNPLANTA Program) and by the European Regional Development Fund (ERDF). Project number PCB-020000-2010-19.
The design and prototyping of a 3D vision sensor based on Time of Flight (ToF) technology on a single CMOS chip.
The project is co-funded by the Ministry of Industry, Energy and Tourism (National Plan for Scientific Research, Development and Technological Innovation 2008-2011) and by the European Regional Development Fund (ERDF). Project Number TSI-080500-2011-103.
This project aims to design a 3D image sensor prototype based on Time of Flight technology for advanced video surveillance and automotive applications.
The main technological innovations of the project are the following:
- Design of a 3D vision sensor integrated onto a single chip
- High resolution sensor for the inspection of distant objects
- High speed pixel, double gated and ultra compact design
- High quality images in extreme temperatures conditions
- Accurate depth of field calculation
- High speed data reading
- Flexibility and easy programming.
Intelligent Image Sensors in CMOS Technology with 3D Stacked Chips
The project is co-funded by the Ministry of Economy and Competitiveness and by the European Regional Development Fund (ERDF). Project number IPT-2011-1625-430000.